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  • 19 70 IBM .

    ,

    .

    30,

    .

    (Filler) , , , CTE(Coefficient

    of Thermal Expansion), Modulus

    I/O,

    . Capillary

    ,

    Pre-applied.

    .

    Capillary , Fluxing() 4-Corner/

    Corner Dot .

    , Capillary

    .

    Capillary FCOB(Flip Chip on Board)

    FCiP(Flip Chip in Package),

    .

    CSPCapillary

    . CSP, CSP

    ,

    .

    CSP

    ( 1),

    CSP.

    Capilary

    ,

    , .

    Fluxing()

    .

    Motorola Robert Pennisi

    George Carson, Ph.D. and Michael Todd, Ph.D.

    1. Capillary

    37 20068

  • 38

    .

    Motorola1990

    .

    ,

    .

    .

    .

    . CSP

    .

    CSP .

    .

    ( 2).

    . Capillary

    .

    ,

    .

    CTE

    Capillary .

    .

    .

    .

    CSP , Capillary

    Corner Dot . Corner Dot

    CSP (Dot)

    . , Corner Dot

    .

    .

    SnPb

    .

    .

    CSP

    .

    SnPb CTE

    .

    (Warpage)

    . CSP

    ,

    .

    . CSP 0.3mm,

    180Micron

    . 2. .

    Flux UnderfillApplication

    Place Die Reflow Finished Assembly

  • 39 20068

    .

    .

    .

    .

    50%

    .

    ,

    .

    Pre-applied

    .

    CSP

    . Pre-applied

    .

    Pre-applied ,

    ( 4).

    .

    .

    .

    Pre-applied

    ,

    .

    30

    .

    .

    CTE

    .

    .

    ,

    ,

    .

    [1] R. Pennisi, M. Papageorge, "Adhesive and Encapsulant Material with

    Fluxing Properties," U.S. Patent 5,128,746, July 7, 1992

    [2] Toleno, B. "Underfills in Pb-free Assemblies", Circuits Assembly,

    June 2005

    3. Corner Dot . 4. Pre-applied

    Bump Wafer Dice Wafer Coat WaferWith Underfill

    Tape & Reel or Tray Die

    Flux Application

    OR

    Place Die Reflow Finished Assembly

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