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19 70 IBM . ,.30, . (Filler) , , , CTE(Coefficientof Thermal Expansion), Modulus I/O, . Capillary , Pre-applied. .Capillary , Fluxing() 4-Corner/Corner Dot . , Capillary .Capillary FCOB(Flip Chip on Board) FCiP(Flip Chip in Package), . CSPCapillary . CSP, CSP, .CSP( 1), CSP.Capilary , , . Fluxing() .Motorola Robert PennisiGeorge Carson, Ph.D. and Michael Todd, Ph.D. 1. Capillary 37 2006838 .Motorola1990.,. .. . CSP . CSP . .( 2).. Capillary . , . CTE Capillary . . . .CSP , Capillary Corner Dot . Corner DotCSP (Dot). , Corner Dot . .SnPb . .CSP . SnPb CTE.(Warpage) . CSP, .. CSP 0.3mm, 180Micron . 2. .Flux UnderfillApplicationPlace Die Reflow Finished Assembly39 20068. . .. 50% . , .Pre-applied . CSP . Pre-applied . Pre-applied , ( 4). . . . Pre-applied , . 30 . . CTE . . , , . [1] R. Pennisi, M. Papageorge, "Adhesive and Encapsulant Material withFluxing Properties," U.S. Patent 5,128,746, July 7, 1992[2] Toleno, B. "Underfills in Pb-free Assemblies", Circuits Assembly,June 2005 3. Corner Dot . 4. Pre-applied Bump Wafer Dice Wafer Coat WaferWith UnderfillTape & Reel or Tray DieFlux ApplicationORPlace Die Reflow Finished Assembly

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